Photonic Wire Bonding: Using Lasers to Integrate Lasers

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Photonic Wire Bonding: Using Lasers to Integrate Lasers

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  • Author: J. Sperling and M. Lauermann
Photonic integrated circuits (PICs) are poised to transform applications such as high-speed optical communications, optical signal processing, optical sensing, and quantum information processing. Hybrid integration involves constructing a PIC using discrete chips made of two or more different materials, to exploit their complementary advantages. Photonic wire bonding, the optical analog to metal wire bonding in electronics, considerably simplifies the assembly of such optical systems.

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