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High Quality Flex Printed Circuit (FPC) Processing with UV Picosecond Lasers

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High Quality Flex Printed Circuit (FPC) Processing with UV Picosecond Lasers

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Ultrashort pulse (USP) lasers are increasingly used for industrial manufacturing, with key application spaces including glass processing, metal engraving, and medical device manufacturing. At the infrared (IR) wavelength of ~1 µm, the short pulse duration enables high quality processing with low heat effects compared to longer nanosecond and microsecond pulse widths, resulting in minimal melting and burrs when processing metals and reduced chipping and cracking when processing glass. In many cases, however, a shorter ultraviolet (UV) wavelength introduces additional benefits. The shorter wavelength enables smaller focus spot sizes and a longer processing depth of field.

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