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Very High-Quality Cutting of Thin Glass and Sapphire with the Icefyre® Picosecond Laser

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Very High-Quality Cutting of Thin Glass and Sapphire with the Icefyre® Picosecond Laser

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Processing of glass and other transparent brittle materials is an important application area for lasers. Laser cutting of glass is used in areas such as display and mobile device manufacturing, electronics packaging, automotive glass, and photovoltaics manufacturing. Across these industries, a variety of glass thicknesses needs to be addressed. For mobile devices, the trend is toward thinner glasses. This is due to the requirement for devices to be lighter weight, flexible and bendable.Leveraging prior work in Bessel beam glass processing we have used Bessel beam optics specifically selected to produce a short Bessel regionfrom the output of a Spectra-Physics IceFyre 1064-50 industrial picosecond laser to process thin glass and sapphire.

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