New Materials in 5G Flex Circuits Processed with High Power Picosecond UV Lasers
Flex printed circuit (FPC) manufacturing has grown in tandem with the market for powerful, rugged and compact electronic devices. FPCs are found in large numbers in a wide range of consumer products including smartphones, watches, and a growing suite of “wearable” electronics. Lasers are integral to FPC manufacturing, with common processes including drilling for copper via formation and profile cutting (routing) for device singulation. The materials comprising flex circuits can be highly varied and often include copper foil conductors and polyimide sheet dielectric layers. To accommodate the progression to faster communications technology, newer materials have recently been introduced to FPC manufacturing.
