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Cutting 5G Flex PCB Materials with a high energy, high power Nanosecond UV Laser

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Cutting 5G Flex PCB Materials with a high energy, high power Nanosecond UV Laser

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Laser processing continues to have a strong impact on printed circuit board (PCB) manufacturing, helping drive the development of devices with improved performance and lower power consumption. Today, a highly diverse set of materials—from thick fiber composites like FR4 to thin flexible laminates—are processed in a variety of ways with a range of laser sources. Of particular note is flex-PCB (FPCB) technology, where developments are frequent since it is tied to the rapidly evolving mobile device market. One such development is 5G mobile communications, which allows for significant increases in wireless data rates.

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