PCB Manufacturing

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PCB Manufacturing

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Lasers are routinely used in a variety of PCB manufacturing processes including via drilling, depaneling, profiling (cutting), laser direct imaging (LDI), repair, trimming, and marking. Laser technology being a non-contact process completely eliminates mechanical stress on the material. Burr formation and micro-cracking in material are also avoided. The tighter focus achievable with UV lasers can controllably remove small volumes of material, reducing deposits of ejected material on the circuits. Precision micromachining achievable with UV lasers allows more circuits to fit on a single panel, increasing the net usable area. Moreover, UV wavelengths are absorbed by a variety of materials in PCBs, from copper to polyimide films, thus providing a onesolution-for-all-materials-and-processes kind of flexibility.

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