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Testing Bond Quality by Measuring Thermal Resistance of Laser Diodes

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Testing Bond Quality by Measuring Thermal Resistance of Laser Diodes

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  • Author: Dr. Stephen Bennett
The invention of the laser has revolutionized science and industry. The fi rst lasers, made of solids (ruby lasers), liquids (dye lasers) and gasses (HeNe lasers), tended to be large devices. The introduction of the semiconductor laser, or laser diode (LD), opened the way for new technologies such as CD players, laser printers, and most recently optical telecommunications. After determining the proper way to manufacture the laser chip itself, one of the most important steps in the manufacture of LDs is bonding the chip onto some sort of sub-mount that allows the laser to be handled, durable electrical connections to be made, and heat to be conducted away from the laser itself. The ability to conduct heat away from the laser is critical in keeping operating temperatures low, thus improving the laser’s performance and its lifetime.

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