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At the OFC 2020 event, the Optical Internetworking Forum (OIF) will host one of the largest interoperability demos in its history reflecting the ongoing significance of its work in addressing global network challenges. Twenty industry-leading system vendors, component vendors and test equipment vendors will demonstrate critical insight into how key technologies – 400ZR, Common Electrical I/O (CEI)-112G, Flex Ethernet (FlexE) and Integrated Coherent Transmit-Receive Optical Sub Assembly (IC-TROSA) – interoperate within the industry’s ecosystem at the event taking place in San Diego, from March 10-12, 2020.
Participating OIF members will include Acacia Communications, Amphenol, Arista Networks, Cadence Design Systems Inc., Cisco Systems Inc., Credo Semiconductor (HK) Ltd, Fujitsu Optical Components, II-VI Inc, Inphi Corporation, Juniper Networks, Keysight Technologies, Marvell, Microchip, Molex, NeoPhotonics, Samtec Inc., Spirent Communications, TE Connectivity, VIAVI Solutions and Yamaichi Electronics.
OIF Demonstrations at OFC 2020:
400ZR Demo
OIF has defined the 400ZR interface that provides interoperability of coherent optical interfaces for data center interconnect applications. The demo will show ‘first time ever’ operation of 400ZR equipment from multiple system and module vendors and in multiple pluggable form factors.
CEI-112G Demo
The CEI-112G demo will feature interoperating channels, components and silicon that demonstrate the CEI-112G-XSR, CEI-112G-VSR, CEI-112G-MR and CEI-112G-LR draft implementation agreements. Demonstrating interoperability for extra short reach channels is important to support the co-packaging developments that are expected to be discussed throughout the week at OFC. Interoperable very short reach, medium reach and long reach channels and silicon are also critical to support the developing 112 Gbps equipment that is expected to come to market soon. These updated demos surpass what OIF has demonstrated in the past with additional member contributions and continue to build on the developing ecosystem of products coming to market to support CEI-112G.
FlexE Demo
The FlexE demo that will be on display incorporates FlexE silicon operating with multiple test equipment and interoperating over a 400 Gbps fiber network that will be deployed on the show floor between the Ethernet Alliance booth and the OIF booth. This reflects further developments that are taking place in the FlexE market since the previous OIF FlexE demos.
IC-TROSA Demo
The IC-TROSA features all the optical building blocks for a coherent module in a single package. This demo will highlight important aspects of IC-TROSA integration as well as real-time EVM measurements with the updated script for 400ZR. An additional point of interest will be a static display of coherent optical components which will emphasize the role of OIF in the coherent optical marketplace over the past 10 years.
OIF Activities at OFC 2020
OIF experts will participate in two panels at OFC 2020 that feature the latest updates on critical technologies that work to enable a more efficient and reliable network.
400ZR Specification Update: Industry experts from OIF will lead a panel discussion of representatives from the DSP, optics, equipment and end user communities on the conflicting demands for a near-term, high-volume, interoperable, moderate reach, and coherent 400G optical link. The session will also include an update on OIF’s project to define a 400ZR link specification.
- DATE: Tuesday, 10 March, 13:30 – 14:30
- VENUE: Theater III
- MODERATOR: Karl Gass, OIF PLL WG Vice Chair Optical
- SPEAKERS: Josef Berger, Inphi Corporation; Masahiro Mogi, Fujitsu Optical Components; Gert Sarlet, II-VI; Marc Stiller, NeoPhotonics and Markus Weber, Acacia Communications
112 Gbps Electrical Interfaces – An OIF update on CEI-112G: OIF experts will lead a panel discussion on the ongoing CEI-112G electrical interface development projects, and the new architectures they will enable including chiplet packaging, co-packaged optics and internal cable-based solutions. The panel will provide an update on the multiple interfaces being defined by OIF including CEI-112G MCM, XSR, VSR, MR and LR for 112 Gbps applications of die-to-die, chip-to-module, chip-to-chip and long reach over backplane and cables.
- DATE: Wednesday, 11 March, 16:15 – 17:00
- VENUE: Theater II
- MODERATOR: Nathan Tracy, OIF President, TE Connectivity
- SPEAKERS: Ed Frlan, OIF Technical Committee Chair, Semtech, Corp.; Mike Li, OIF Board, Intel; Cathy Liu, OIF Board, Broadcom, Inc.; Gary Nicholl, OIF Board, Cisco; Steve Sekel, OIF PLL Interoperability WG Chair, Keysight Technologies
Cu (see you) Beyond 112 Gbps Workshop: OIF will hold a half-day workshop “Cu (see you) Beyond 112 Gbps” featuring experts from Arista, Broadcom, Inc., Cisco, Facebook, Google, Innovium, Intel, MACOM and TE Connectivity discussing the needs and challenges for electrical interfaces beyond 112 Gbps.
- DATE: Thursday, 12 March, 12:00-17:30
- VENUE: Hilton San Diego Gaslamp, 401 K St (across from the SD Convention Center), San Diego, Ca.
Registration is required to attend the events.
Registration fee for OIF Members is $150.00. Click here to register.
Registration fee for Non-Members/General Public: $200.00. Non-Members click here to register.
Click here to check the status of OIF’s current work.
Click here to follow the latest updates from the OFC 2020 Conference & Exhibition.
