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The FS-343-2 from Photonics Industries is a Femtosecond Laser that operates at a wavelength of 343 nm. It delivers an average power of 2 W (at 1 MHz) and has a pulse energy of 2 μJ (at 1 MHz). This laser has a pulse width of 450 fs - 5 ps (at 1 MHz) and repetition rate from single shot to 2000 kHz. It has a pulse-to-pulse stability of less than 2% RMS and long-term power stability of up to 1% RMS. This laser has a TEM00 mode with a polarisation extinction ratio over 100:1 and beam quality factor (M2) below 1.3.

The FS-343-2 has a maximum beam divergence of up to 2 mrad and beam-pointing stability below 25 μrad. It produces a beam of diameter 0.5 mm (at the exit end) and has a beam circularity above 90%. This laser features dynamic pulse energy control (PEC) and position-synchronized output (PSO). It can be controlled via software GUI, external TTL triggering, RS232, and Ethernet interfaces. This laser requires a DC supply voltage of 15 V, consumes 17 A of current, and dissipates below 500 W of power.

The FS-343-2 is available in a robust and compact module that measures 558 mm x 254 mm x 114.3 mm. It is ideal for micromachining, 3D micro structuring & drilling, diamond marking & drilling, semiconductor & LIPSS, hydrophobic & hydrophilic material manufacturing, LCD/LED/OLED display repair, terahertz, X-ray & OPO/OPA systems, photoemission, Raman, multiphoton microscopy, and CNC micro-fabrication applications.

Product Specifications

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Product Details

  • Part Number
    FS-343-2
  • Manufacturer
    Photonics Industries
  • Description
    343 nm Femtosecond Laser for Marking & Drilling Applications

General Parameters

  • Type
    Laser System
  • Configuration
    Laser Head with Control Unit (Integrated), OEM Laser Module
  • Ultrafast Laser
    Femtosecond Lasers
  • Application Industry
    Automotive / Industrial & Manufacturing, Scientific Research, Environmental, Entertainment, Defense / Military & Aerospace
  • Application
    Micromachining, 3D Micro structuring and Drilling, Diamond Marking and Drilling, CNC Micro-Fabrication, Semiconductor and LIPSS – Surface Modifications, Hydrophobic and hydrophilic material manufacturing, LCD/LED/OLED display repair, Terahertz, X-ray & OPO/OPA systems, Photoemission, Raman, multiphoton microscopy
  • Operation Mode
    Pulsed Laser
  • Wavelength
    343 nm
  • Wavelength Accuracy
    ±2 nm
  • Power
    2 W
  • Pulse Energy :
    2 µJ
  • Pulse Energy
    2 µJ
  • Pulse Width
    <450 fs to 5 ps
  • Repetition Rate
    Single Shot to 2000 kHz
  • Pulse to Pulse Stability
    <2% RMS
  • Tunable
    No
  • Fiber Coupled
    Yes
  • Laser Color
    Ultraviolet
  • Polarization ratio :
    >100:1
  • Transverse Mode
    TEM00
  • Beam Divergence :
    <2 mrad
  • Beam Quality Factor (M2) :
    <1.3
  • Beam Shape
    Circular
  • Current
    17 A
  • Laser Class
    Class 4
  • Warm up time
    <30 mins (standby), <15 mins (cold start)
  • Power Consumption
    <500 W
  • Power Stability
    <1% RMS
  • Pointing Stability :
    <25 µrad
  • Interface
    RS232, Ethernet, TTL
  • Power Supply
    100 to 240 VAC, 50 to 60 Hz
  • Voltage
    15 VDC
  • RoHS
    Yes

Physical Properties

  • Dimension
    558 x 254 x 114.3 mm
  • Weight
    21.3 kg
  • Beam Diameter
    0.5 ± 0.5 mm

Environmental Conditions

  • Cooling Method
    Air Cooled
  • Relative Humidity
    0 to 80%
  • Altitude
    Sea level to 12000 m
  • Operating Temperature
    15 to 30 Degree C
  • Storage Temperature
    5 to 40 Degree C

Technical Documents

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