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| Latest Photonics Products | | | 1530 to 1565 nm Fiber-Coupled External Cavity Laser for Remote Sensing and LiDAR Applications | | Redfern Integrated Optics | | The PLANEX™ from Redfern Integrated Optics is a Fiber-Coupled External Cavity Laser (ECL) with a center wavelength from 1530 to 1565 nm. It delivers up to 20 mW of power and has an optical isolation of 40 dB. The single frequency laser supports CW, modulated, and pulsed operations and has a wavelength tuning range of 30 pm and a modulation bandwidth from DC to 200 kHz. This laser has low phase noise and a narrow linewidth of less than 1 kHz. It has an integrated gain chip and a Planar Lightwave Circuit (PLC) that includes Bragg grating. The laser is suitable for remote sensing, distri... | | Download Datasheet | Product Details | | | | | | Up to 1 Watt Output Power 640 nm DPSS Lasers | | Uniklasers Ltd | | The Solo 640 Series from Uniklasers is a Single Frequency DPSS laser that delivers an output power of 100 to 1000 mW at 640 nm. This laser is well suited for holography applications, high precision metrology, Brillouin imaging, Raman spectroscopy, confocal microscopy, semiconductor metrology, and other emerging applications. The laser head measures 80 x 65 x 172.2 mm and the controller measures 170 x 53.5 x 163 mm. | | Download Datasheet | Product Details | | | | | | Ultra Narrow Linewidth Tunable Laser from 670 to 1050 nm | | M Squared | | The SolsTiS from M Squared is a Ti:Sapphire Tunable Laser that operates from 670 to 1050 nm. It delivers up to 5 W of CW power, has a line width of less than 50 kHz, and an amplitude noise of less than 0.05%. This laser is available in a compact module with an integrated laser head (11.5 x 6.7 x 2.6 inches). The laser is suitable for atom trapping and cooling, high-resolution spectroscopy, squeezed light, and quantum optics applications.
| | Download Datasheet | Product Details | | | | | | 48 Mega Pixel CMOS Image Sensor for Smartphones and Video Conferencing | | OmniVision Technologies | | The OV48C from OmniVision is a 48 MP CMOS Image Sensor with a 1.2 micron pixel size. It is the industry's first image sensor for high resolution mobile cameras with on-chip dual conversion gain HDR, which eliminates motion artifacts and produces an excellent signal-to-noise ratio (SNR). This sensor also offers a staggered HDR option with on-chip combination, providing smartphone designers with the maximum flexibility to select the best HDR method for a given scene.
Built on OmniVision's PureCel®Plus stacked die technology, this 1/1.3" optical format sensor provides leading... | | Download Datasheet | Product Details | | | | | | 2.8 Mega Pixel CMOS Image Sensor with Wide Dynamic Range | | Canon U.S.A | | The 3U3MRXSAAC from Canon U.S.A is a CMOS Image Sensor with a resolution of 2.8 MP. It is equipped with an HDR drive function that achieves a wide dynamic range of 120 dB at low noise levels. This wide range results in a greater ability to extract usable information even where there is a substantial difference between the lightest and darkest areas of an image. Even when using the sensor during normal drive operation, the sensor can achieve a dynamic range of 75 dB.
With a diagonal size of 7.75 mm, the 3U3MRXSAAC features approximately 2.8 million effective pixels (1936 x 1456), a pixel siz... | | Product Details | | | | | | | | | | Latest Photonics News | | | | OmniVision Unveils First 64 Megapixel, 0.8 Micron Image Sensor for Smartphone Cameras | | OmniVision Technologies | | OmniVision Technologies has released its first 64 MP image sensor, the OV64C, featuring a 0.8 micron pixel size to enable high resolution smartphone cameras in a 1/1.7" optical format. Built on OmniVision's PureCel Plus stacked die technology, this sensor provides leading edge still image capture and exceptional 4K video performance with electronic image stabilization (EIS) for high end smartphones. | | Read More | | | | | | | | | | | Metasurfaces-Integrated VCSELs Enable Remarkable Laser Beam-Shaping Applications | | Apart from the indispensable contributions of vertical cavity surface-emitting lasers (VCSELs) to the development of modern optoelectronic technologies, their problem of arbitrary beam shaping within a compact system is still the same. But now a new research, led by Patrice Genevet of the Centre de Recherche sur l’Hétéro-Epitaxie et ses Applications (CRHEA)… | | Read More | | | | | | Gentec-EO Announces 2020 Laser Lab Awards Contest | | Gentec-EO | | Laser beam and terahertz source measurement and analysis expert, Gentec Electro-Optics (Gentec EO), has announced the launching of the 2020 Laser Lab Awards contest. Twelve winners will receive one of the five laser beam measurement kits of their choice among a selection of products made by Gentec-EO. The contest ends on March 31, 2020. | | Read More | | | | | | USB LiFi Modules With World's Highest Data Rate of Up To 1 Gbit/s | | The Fraunhofer Heinrich Hertz Institute (Fraunhofer HHI) has developed a USB-operated LiFi system with low power consumption, thus achieving world's highest data rate of up to 1 Gbit/s in a mobile LiFi end device. LiFi enables fast mobile communication for indoor areas. In a LiFi transmission, the unlicensed optical spectrum is used for wireless data transmission. In contrast to the radio, light can be controlled… | | Read More | | | | | | First 0.26 Inch Fully Addressable Integrated microLED Display Module for AR/MR | | Plessey Semiconductors Ltd | | Plessey Semiconductors, an embedded technologies expert, in partnership with Compound Photonics (CP), a leading provider of compact high-resolution micro-display solutions, has developed the first fully addressable microLED display modules. These new modules are a result of their previously announced strategic partnership to develop and introduce GaN-on-Silicon microLED based micro-display solutions for AR/MR applications. | | Read More | | | | | | HORIBA Scientific & UC Irvine to Jointly Host RamanFest 2020 Conference | | HORIBA | | Raman spectroscopy systems pioneer, HORIBA Scientific, will once again be sponsoring the RamanFest this year, which will be held at the University of California Irvine, on Monday, June 29th, and Tuesday, June 30th. It is being held in association with the Advanced Power and Energy Program (APEP) at the UCI Henry Samueli School of Engineering. | | Read More | | | | | | Time-of-Flight Sensor Market to be Worth $6.9 Billion by 2025 | | According to the new research report ‘Time-of-Flight (ToF) Sensor Market Global Forecast to 2025’, published by MarketsandMarket, the ToF sensor market is expected to grow from USD 2.8 billion in 2020 to USD 6.9 billion by 2025, at a CAGR of 20.0%. The growth of this market is mainly driven by the increasing demand for ToF sensors from the automotive industry and the growing adoption of 3D cameras… | | Read More | | | | | | Veeco Releases New MOCVD Platform to Enable High Performance Photonics Devices | | Veeco Instruments | | Semiconductor process equipments developer, Veeco Instruments, has announced the release of its Lumina Metal Organic Chemical Vapor Deposition (MOCVD) platform, which incorporates the proprietary TurboDisc reactor technology for outstanding film uniformity, yield and device performance for a variety of photonics applications. This new MOCVD platform, including the Lumina R480… | | Read More | | | |
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